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Finetech XT0292 Semi-automated Sub-Micron Bonder FINEPLACER® sigma
Artikelnr.	XT0292 Merk Finetech Model FINEPLACER® sigma

Omschrijving	Semi-automated Sub-Micron Bonder FINEPLACER® sigma

Detailomschrijving: The FINEPLACER® sigma combines sub-micron placement accuracy with a 450 x 150 mm working area and bonding forces up to 1000 N. The system is ideal for all types of precision die bonding and flip chip applications at chip and wafer level. This includes complex 2.5D and 3D IC packages, Focal Plane Arrays (i.e. image sensors), MEMS/MOEMS, and more. Placing small devices on large substrates is made possible by the FPXvisionTM optical system design. With this alignment system, the smallest structures at the highest magnification can be viewed across the entire field of view. Moreover, FPXvisionTM introduces pattern recognition to a die bonder with manual alignment.



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Finetech XT0292